Application of phosphor copper anode material in printed circuit board

The application of phospho-copper anode in acid copper plating in printed circuit board manufacturing, and the advantages and development trend of microcrystalline phospho-copper anode materials in high grade PCB manufacturing.

Copper is a rose red metal with good electrical conductivity, thermal conductivity and ductility. The density is 8.96, the melting point is 1083°C, the boiling point is 2595°C. Copper is in the DS region of the periodic table and belongs to the first subgroup element. Copper is one of the first choice of conductive materials because of its conductivity, second only to silver. Copper coating has fine grain structure, modern electroplating industry can be from the cheap copper plating solution, plating bright, good leveling, high toughness copper coating. In PCB manufacturing process, through - hole copper plating and line copper plating can obtain excellent results.

With the upgrading of electronic products, the requirements for printed circuit board are higher and higher. Printed circuit board is developing in the direction of thinner width and smaller aperture. At the same time, the market demand for high level HDI board, high multi-layer board, flexible board, rigid flexible combined board, IC carrier board and so on is increasing. These high-level printed circuit boards also require more and more technology in the manufacturing process. The performance requirements of PCB products on copper plating layer are becoming more and more strict, such as coating hardness, grain size, pore dispersion ability, coating ductility and so on; These high requirements of copper plating layer, the requirements of electroplating is higher, which also put forward higher requirements for copper anode materials.