What is the effect of copper wire impurities on copper properties

Copper wire processing materials will be divided into four categories: ordinary copper wire (T1, T2, T3, T4), oxygen-free copper (TU1, TU2 and high purity, vacuum oxygen-free copper), reduced copper (TUP, TUMn) and special copper containing atiny low amount of alloying elements (arsenic copper, tellurium copper, silver copper). Copper wire life, practical copper wire to try to to wire. Good electrical conductivity, lots of used for manufacturing wire, cable, brush, etc. Good thermal conductivity, commonly wont to manufacture magnetic instruments and instruments to forestall magnetic interference, like compass, aviation instruments; Excellent plasticity, easy hot pressing and cold pressure processing, may be made into tubes, rods, wires, strips, strips, plates, foils and other copper materials. Pure copper products are smelted and processed products. Copper wire is second only to silver in electrical and thermal conductivity and is widely utilized in the manufacturing of electrical and thermal conductivity equipment. Copper wire has good corrosion resistance in air, sea water and a few non-oxidizing acids, alkali, salt solution and a spread of organic acids (acetic acid, citric acid). it's employed in the industry. additionally, copper wire has good weldability, may be cold thermoplastic processing into a spread of semi-finished products and finished products. within the 1970s, copper wire production exceeded the overall production of other copper alloys. Trace impurities in copper wire have great influence on the electrical and thermal conductivity of copper. Among them, ti, P, Fe and Si significantly reduced the conductivity, while CD and Zn had little effect on the conductivity. The solid solubility of oxygen, sulfur, selenium and tellurium in copper is extremely small, and that they can form brittle compounds with copper, which have little effect on electrical conductivity, but reduce machining plasticity. When ordinary copper wire is heated in an exceedingly reducing atmosphere containing or CO,  monoxide can easily interact with cuprous oxide (Cu2O) on the grain boundary to provide high-pressure water vapour or carbonic acid gas gas, thus causing copper fracture. Oxygen is harmful to the solderability of copper. Bismuth or lead and copper form eutectic with low temperature, which ends up in thermal embrittlement of copper, while brittle bismuth distributes in thin film at grain boundary, which ends up in cold embrittlement of copper. Phosphorus can significantly reduce the electrical conductivity of copper, but improve the fluidity and weldability of copper liquid. Proper amount of lead, tellurium and sulfur can improve the machining performance. The strength, elongation and Brinell hardness of copper wire annealed at temperature are 22 ~ 25 kg/mm2, 45 %~ 50 %, 35~45.